We participates in employment guidance PART1 in 2013.
It is employment guidance for the student who is going to graduate from a postgraduate course university, a junior college, a technical college, and a vocational school in 2014 and 2013, or a graduate.

Date and Hour：February 22nd , 2013.
PM 13:00 ～ PM 17:00
Location：Fukuyama New Castle HOTEL (88-16,Sannomaru-Cho,Fukuyama )
On the third floor KOYO

 

The homepage had closed by server trouble.
I'm sorry to put you to so much trouble.
One by one, it restores.

 

Now, our company "SUNSAY INDUSTRIES CO., LTD" has March 28, 2012, merges with "SUNSAY GENERIC CO., LTD", and is allowed to set a company name to "SUNSAY GENERIC CO., LTD."
SUNSAY GENERIC CO., LTD is mainly taking charge of an overseas transaction, development of 300-mm products, and manufacture. Moreover, since maintenance of a product is similarly continued as before, I'm looking forward to doing business with you.

 

The integrated (quality and scene) plan was updated.

 

SUNSAY was introduced as "an active company of the Fukuyama area known by comics" to the Fukuyama area company guide, for the 2013 edition.

 

（株）东京商工Research发行的 (最优良企业Magazine / Choice 版本)上、被介绍了作为三星等级的Company来面向于学生。

 

参加了『冈山・广岛企业魅力发信合同企业说明会』。
由冈山县和广岛县共同开催的、大学院、大学、短期大学、高等专门学校、专修学校的学生生、就职担当者等以对象来开催的合同企业说明会。
●开催时间：2012年（平成24年） 1月13日（金）
13：00～16：00
● 开催场所：笠冈综合体育馆
冈山县笠冈市平成町 63-2
● 内容：（1）企业的魅力发信
每个企业都有设置展位、由企业人事担当者来进行企业的概要•工作内容的说明
（2）Career Counseling
（3）企业的宣传手册•PR资料展示
（4）从主办方和共同办理方团体来的PR
●事务局：冈山县产业劳动部紧急雇佣对策室

 

●日经Electronics （日经BB社发行）
在2011-11-14号三诚产业的技术被介绍到了！
◆ 向低被炸化加速、最新医疗机器◆
面向于医疗机器的低被炸化的技术开发已经被带到热门阶段了。
由东日本大震灾开端的根据原子能爆炸事故、对于被爆的、是以提高患者的意识为背景的。

然后、医疗机器本来的性能和大幅度的低被爆化得到了两种技术同时陆陆续续的登场。
弊社、CSI（Cesium iodide）的均一结晶使其成长、是荧光体制造的关键科技、ESC（静电）Chuck的表面精度、使其提高到了4～20nm（24mm/100万）实现了高感度化。

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《TMS研修会》TMS纪念研修会的展示情报・作为演讲者被介绍了
◆三诚产业（株）◆
世界的半导体・从液晶业界的大企业得到了很大的信赖和独创性技术力的评价属于TOP Venture。
Plasma发振用Generator以及Matcher是有着高精度制御・高安定性・高耐久性的实绩、现在，在World Wide的生产线上使得被安心的适用着、显示出了生产效率的向上和成本优点增大的实绩！
以出色的高真空・高温耐久性Wafer搬送机器人，搬送机器人作为高寿命制品在业界的Standard Level为止正在成长中。

 

The presentation was carried out in SEMI FORUM JAPAN 2011.
Lecture title：Introduction of the semiconductor newest ultra-fine processing technology
Lecture summary：Introduction of the 2X～3Xnm ETCHING SYSTEM
　　　　　　　　　　Introduction of the high pressure ICP PLASMA SYSTEM